Wafer-level Test and Burn-in Market Report, By Type of Test (Electrical, Thermal, Parametric, Functional); Application (Consumer Electronics, Automotive, Telecommunications, Industrial Electronics); Technology (Static Burn-In, Dynamic Burn-In, Traditional Testing, Advanced Testing); End-User (Semiconductor Foundries, Fabless Semiconductor Companies, Integrated Device Manufacturers [IDMs], Research Institutes); and Regions 2024-2032

Market Overview:

"The global Wafer-level Test and Burn-in market was valued at US$ 3.9 Billion in 2023, and is expected to register a CAGR of 4.2% over the forecast period and reach US$ 5.7 Bn in 2032."

Report Attributes	Details
Base Year	2023
Forecast Years	2024-2032
Historical Years	2021-2023
Wafer-level Test and Burn-in Market Growth Rate (2024-2032)	4.2%

Wafer-level Test and Burn-in (WLTBI) refers to the process of conducting electrical testing and burn-in of semiconductor devices when these are still in wafer form. The burn-in process is temperature-based and tests the stress reliability for detection or screening of potential of failure of these components early on during function. A wafer prober comprising ultrathin probing needles numbering in the hundreds to thousands is ideally employed to supply the required electrical excitation to the die on the wafer and onto the bond pads, balls, and pumps on the die. The wafer is heated up by the wafer prober to the required die temperature using a built-in hot plate to reach the correct junction temperature.   

Wafer-level testing and burn-in is applicable to devices offered as bare die, also known good die or KGD, as well as for wafer-level packaged devices and devices designed for conventional packaging. Wafer-level packaging is basically an extension of traditional wafer fabrication process to enable each die on the wafer to interconnect to the external world and eliminates need for separate Integrated Circuit (IC) packaging/assembly line. 

High demand for semiconductors from automotive and telecommunications industries electronic systems, vehicle infotainment systems, engine control systems, and systems governing safety features, as well as expanding application areas for these and more advanced components in other industries such as Electric Vehicles (EVs) is a major factor driving incline in need for semiconductor wafers testing and supporting rapid growth of the WLTBI market.

Wafer-level Test and Burn-in Market Trends and Drivers:

WLTBI helps lower product cost in semiconductor manufacturing, and semiconductors are getting increasingly complex, and all-the-more with the rise of System-on-Chip (SoC) and advanced process nodes, which also necessitates thorough testing at wafer level to ensure optimized performance and reliability. Demand for high quality and reliable components continues to increase rapidly from the automobile, telecommunications, and consumer electronics industries, and the need to meet stringent safety and quality standards is driving incline in demand for wafer-level test and burn-in solutions in the market. Also, high competition in the industry is driving focus among component and electronics devices manufacturers to reduce time-to-market and manufacturing costs, thereby highlighting the importance of WLTBI in testing performance, enabling detection of defects, saving on resources, and improving overall production efficiency and enhancing brand image.

In addition, advancements in technologies and integration of 5G, Artificial Intelligence (AI), and Internet of Things (IoT) and the need for high-performance and reliable semiconductors is resulting in the creation of new application areas for WLTBI. Ongoing Research and Development (R&D) in the semiconductor industry has been leading to steady advancements in WLTBI technology and solutions, with the emergence of more sophisticated testing methodologies and automation of various processes. Not only are these advancements enabling faster time-to-market, but are also enhancing testing accuracy, speed, and cost-effectiveness.

The miniaturization trend in components and electronics is also having a major impact ion the WLTBI solutions market, with need for more comprehensive testing and burn-in process at wafer level gaining importance. The need for smaller and more compact or densely-packed components is rising along with need to comply with various standards, and this is also driving demand for more efficient testing in the semiconductor industry.

Wafer-level Test and Burn-in Market Restraining Factors:

High cost of deploying WLTBI infrastructure is a key factor expected to restrain new entrants into the industry, and investment in specialized equipment and supporting facilities can be substantially high. This is particularly the case with regard to smaller scale semiconductor manufacturers and companies seeking to expand into developed economies. Complexity and scalability is another major challenge, and the challenges are expected to continue to increase as semiconductor designs become more complex due to technological advancements and innovation in the industry. Testing and burn-in procedures will become more intricate, thereby raising challenges to scale, and potentially limiting adoption of WLTBI.

Yield reduction risk is another factor to consider, and while WLTBI improves quality and reliability, stress applied during testing can lead to yield reduction if processes are not calibrated appropriately. This can result in fewer manufacturers adopting technology, especially in scenarios where yield is a critical metric. Another major factor is regulatory and safety compliance, and this is challenging due to presence of diverse global regulatory standards and safety norms. Complying or meeting varying standards and standards can be costly and time-consuming, and cause delays in adoption.

Technical limitations such as limitations in current testing methods or the inability to thoroughly test advanced chips with fine geometries can impact the effectiveness of WLTBI. Also, such limitations may raise the need for R&D investment to remain up to speed with constantly evolving semiconductor technology.

Wafer-level Test and Burn-in Market Opportunities:

Technological advancements and innovation continue to drive changes in various industries, and electronics is an area that is constantly evolving, and rapidly at that. Companies can focus on customization and specialization to develop and offer solutions tailored to specific client needs to maintain an edge in the market. This can include customized WLTBI solutions for niche applications and in industries such as automotive, aerospace, and defense, wherein focusing on specialized testing requirements can enable manufacturers to attract higher prices and build robust client relationships.

Companies can also enter partnerships with semiconductor foundries to develop integrated testing solutions, thereby streamlining the supply chain and ensuring seamless quality assurance processes, which is an approach that can enhance market reach and operational efficiency of manufacturers of these solutions. Also, developing WLTBI solutions that integrate advanced packaging technologies, such as 2.5D/3D packaging and fan-out wafer-level packaging can enable companies to cater to evolving demands for high-performance semiconductor devices. In addition, R&D initiatives to explore more innovative testing methodologies and equipment can result in enhanced testing speed, accuracy, and cost-effectiveness, and lead to development of new products and services to cater to needs for integrating AI, IoT, and 5G.

Market expansion is another strategy companies can focus on, especially emerging markets with high-potential and new opportunities for growth and diversification. In such markets, providing accessibility to newer technologies and cost-effective WLTBI solutions can enable entrants to leverage market share and gain a robust foothold in surrounding regions as well.

Wafer-level Test and Burn-in Market Segmentation:

By Type of Test

• Electrical Test
• Thermal Test
• Parametric Test
• Functional Test

The electrical test segment is expected to account for the largest revenue share in the Wafer-level Test and Burn-in (WLTBI) market over the forecast period. This can be attributed to the critical role an electrical test plays in assessing the functionality and performance of Integrated Circuits (ICs) at the wafer level, ensuring quality and reliability. Electrical testing encompasses various methods such as logic and memory testing, which are essential for modern semiconductor devices. Increasing demand for high-performance integrated circuits in advanced technologies like AI, 5G, and IoT is expected to continue to drive adoption of electrical testing.  

By Application

• Consumer Electronics
• Automotive Electronics
• Telecommunications
• Industrial Electronics

The consumer electronics segment is expected to account for the largest revenue share in the Wafer-level Test and Burn-in (WLTBI) market over the forecast period. The projection is supported by rapid proliferation of smart devices, such as smartphones, tablets, and wearables, and inclining demand for high-performance and reliable semiconductors. As technology evolves, consumer expectations for seamless, high-quality experiences is expected to only increase, further driving the need for more robust testing and burn-in processes at the wafer level in this segment.

By Technology

• Static Burn-in
• Dynamic Burn-in
• Traditional Testing
• Advanced Testing

Among the technology segments, the advanced testing segment is expected to account for the largest revenue share over the forecast period. Advanced testing includes sophisticated techniques such as adaptive test methods and Built-In Self-Test (BIST), which can handle the increasing complexity and density of modern semiconductor devices. This segment supports the industry's shift towards high-performance and miniaturized ICs, ensuring greater accuracy, efficiency, and reliability in testing processes. As a result, advanced testing is key to meeting the stringent requirements of next-generation technologies like AI and 5G.

By End-User

• Semiconductor Foundries
• Fabless Semiconductor Companies
• Integrated Device Manufacturers (IDMs)
• Research Institutes & Universities

Among the end-user segments, the Integrated Device Manufacturers (IDMs) segment is expected to account for the largest revenue share. IDMs control the entire semiconductor manufacturing process, from design to production, enabling significant benefits from comprehensive WLTBI solutions. By investing in WLTBI, IDMs can ensure high-quality, reliable products, minimizing defects and improving yield. This holistic approach supports IDMs in meeting the demands of advanced technologies such as AI, IoT, and 5G, while also enhancing their market competitiveness.

By Region

North America

• United States
• Canada

Europe

• Germany
• United Kingdom
• France
• Italy
• Spain
• Russia
• Poland
• Benelux
• Nordic
• Rest of Europe

Asia Pacific

• China
• Japan
• India
• South Korea
• ASEAN
• Australia & New Zealand
• Rest of Asia Pacific

Latin America

• Brazil
• Mexico
• Argentina

Middle East & Africa

• Saudi Arabia
• South Africa
• United Arab Emirates
• Israel
• Rest of MEA

The global Wafer-level Test and Burn-in (WLTBI) market is divided into five key regions: North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa. Asia Pacific currently dominates other regional markets in terms of volume sales and consumption of semiconductors owing to robust presence of major semiconductor manufacturers in countries such as China, Taiwan, Japan, and South Korea, which are known for their advanced semiconductor production capabilities and significant investments in WLTBI technology. In North America, the United States (US) leads among the country markets owing to a robust semiconductor industry and continuous innovation in WLTBI technologies.

In Europe, Germany is a major revenue contributor and leader in the industry, benefiting from its well-established automotive and industrial electronics sectors that demand high-quality semiconductor components. Some of the common factors driving overall regional market growth include rising demand for high-performance semiconductors in emerging technologies like AI, IoT, and 5G, technological advancements in WLTBI processes, improving efficiency and reliability, and increased investment in R&D to develop innovative testing methodologies and equipment for the evolving semiconductor landscape.

Leading Companies in Wafer-level Test and Burn-in Market & Competitive Landscape:

The competitive landscape in the global Wafer-level Test and Burn-in (WLTBI) market is characterized by the presence of both established and emerging players striving to innovate and enhance their market position. Companies are investing significantly in research and development to create advanced testing methodologies that can keep pace with the complexities of modern semiconductor devices. Companies are also expanding their product portfolios to include customizable testing solutions that cater to specific client needs across various industries, while majors are entering into strategic partnerships and collaborations with semiconductor foundries, Integrated Device Manufacturers (IDMs), and fabless semiconductor companies in order to integrate their testing solutions directly into manufacturing processes. In addition, companies are focusing on entering emerging markets to build new customer bases and capitalize on rising demand for high-performance semiconductors. By offering cost-effective and efficient testing solutions, leading players are expanding their consumer base and maintaining their competitive edge in the market.

These companies include:

• Aehr Test Systems
• Advantest Corporation
• Teradyne Inc.
• FormFactor Inc.
• Xcerra Corporation
• Astronics Test Systems
• Micro Control Company
• RoodMicrotec N.V.
• COHU, Inc.
• Test Research, Inc. (TRI)
• Aemulus Holdings Berhad
• Integrated Micro-Electronics, Inc. (IMI)
• Spinnaker Systems Inc.
• Averna Technologies Inc.
• Hprobe

Recent Development:

• December 2023: Aehr Test Systems announced receipt of an initial order from a customer for a FOX WaferPak Aligner and a FOX-NP wafer-level test and burn-in system designed for testing gallium nitride (GaN) power devices. The customer is a major global supplier of semiconductor devices used in power infrastructure and electric vehicles, adding to Aehr’s growing list of significant clients that use FOX products for burn-in and wafer-level testing of wide bandgap compound semiconductors. The company expects to deliver and install the FOX-NP system, which includes the FOX WaferPak Aligner, during the current fiscal quarter.
• November 2023: POMME TECHNOLOGIES announced that company will launch new products in 2024 which will include WLBI (wafer level burn in) Tester, SiC/GaN CP Tester, and KGD Test Solutions to enhance their product portfolio and to strengthen their position in the market.
• May 2022: Pentamaster, which is a global provider of comprehensive solutions for standard and tailored test equipment, introduced its second-generation wafer burn-in tester, WLBI-22. This innovation is crucial for the Electric Vehicle (EV) market, as it ensures that each silicon carbide (SiC) chip meets automotive-quality standards before being used in real-world EV applications. This development marks a significant step toward the future of electric vehicles. WLBI-22 improves test time and boosts efficiency over its predecessor, supports testing two wafers in parallel, and can test up to 480 dies per wafer, each with its own driver channels for real-time voltage and current measurement as well as temperature monitoring. The system features a sealed chamber that can hold inert gases like nitrogen and arc suppression gases, safeguarding devices under test from oxidation and arcing. This also allows the tester to operate within a stable temperature range, preventing overheating.

Wafer-level Test and Burn-in Market Research Scope

Report Metric	Report Details
Market size available for the years	2021-2023
Base Year	2023
Forecast Period	2024-2032
Compound Annual Growth Rate (CAGR)	4.2%
Segment covered	Type of Test, Application, Technology, End-User
Regions Covered	North America:  The U.S. & Canada Latin America: Brazil, Mexico, Argentina, & Rest of Latin America Asia Pacific: China, India, Japan, Australia & New Zealand, ASEAN, & Rest of Asia Pacific Europe: Germany, The U.K., France, Spain, Italy, Russia, Poland, BENELUX, NORDIC, & Rest of Europe The Middle East & Africa:  Saudi Arabia, United Arab Emirates, South Africa, Egypt, Israel, and Rest of MEA
Fastest Growing Country in Europe	UK
Largest Market	North America
Key Players	Aehr Test Systems, Advantest Corporation, Teradyne Inc., FormFactor Inc., Xcerra Corporation, Astronics Test Systems, Micro Control Company, RoodMicrotec N.V., COHU, Inc., Test Research, Inc. (TRI), Aemulus Holdings Berhad, Integrated Micro-Electronics, Inc. (IMI), Spinnaker Systems Inc., Averna Technologies Inc., Hprobe